Hewlett Packard reported $12.38B in Loan Capital for its fiscal quarter ending in April of 2025.


Loan Capital Change Date
Advanced Micro Devices USD 3.22B 1000K Jun/2025
Amazon USD 50.72B 18.78B Jun/2025
Amphenol USD 7.13B 309.7M Jun/2025
Apple USD 82.43B 3.86B Jun/2025
Arista Networks USD 0 0 Mar/2025
AT & S Austria Technologie & Systemtechnik AG EUR 1.73B 514.62M Jun/2025
Barco NV EUR 44.86M 12.65M Dec/2024
Broadcom USD 61.75B 825M May/2025
CDW USD 5.62B 800K Jun/2025
Ciena USD 1.53B 2.31M May/2025
Cisco Systems USD 22.86B 4M Jul/2025
Codan AUD 192.05M 57.69M Dec/2024
Cognizant Technology Solutions USD 559M 8M Jun/2025
Corning USD 6.71B 240M Jun/2025
Cx Technology TWD 701.19M 12.5M Mar/2025
Datatec USD 89.73M 11.8M Feb/2025
Dell Technologies USD 21.54B 2.4B Aug/2025
Dicker Data AUD 245M 2.3M Dec/2024
Extreme Networks USD 163.72M 3.57M Jun/2025
F5 Networks USD 0 0 Dec/2024
Fingerprint Cards SEK 900K 1.8M Jun/2025
Fujitsu JPY 96.9B 3.2B Jun/2025
Gold Circuit Elect TWD 5.15B 554.13M Mar/2025
Hewlett Packard USD 12.38B 894M Apr/2025
Hitachi JPY 814.45B 50.3B Jun/2025
HP USD 8.78B 509M Jul/2025
IBM USD 55.22B 1.15B Jun/2025
Intel USD 44.03B 885M Jun/2025
Jabil Circuit USD 2.39B 498M May/2025
Keysight Technologies USD 2.53B 1000K Jul/2025
Lenovo USD 4.66B 55.81M Jun/2025
Logitech International 0 0 Dec/2024
Micron Technology USD 15B 1.15B May/2025
Motorola Solutions Msi USD 7.66B 1.98B Jun/2025
NetApp USD 2.49B 0 Jul/2025
Nvidia USD 8.47B 2M Jul/2025
Oracle USD 85.3B 2.81B May/2025
Positivo Tecnologia BRL 780.3M 91.76M Jun/2025
Prime Electronics TWD 102.88M 25.51M Jun/2025
Qualcomm USD 14.79B 1.53B Jun/2025
Samsung Electronics 14.03T 5.3T Jun/2025
Scientech TWD 1.15B 5.5M Mar/2025
Seagate Technology USD 5B 151M Jun/2025
Sensata Technologies USD 3.2B 520K Jun/2025
Super Micro Computer USD 1.75B 10.86M Dec/2024
SYNNEX USD 3.72B 13.73M May/2025
TE Connectivity USD 4.85B 1.58B Jun/2025
Western Digital USD 2.49B 2.42B Jun/2025
Xerox USD 3.48B 785M Jun/2025
Xiaomi CNY 18.27B 41.02M Jun/2025